EPOXY RESINS
SDF168AB-3 Epoxy Resin
Modified two-component epoxy system for filament winding and RTM.
Product Code: SDF-EPO-028
SDF5050AB-1 Epoxy Resin: Flowable black epoxy system for electronic-component potting and moisture protection.
Epoxy selection must consider viscosity, pot life, mix ratio, exotherm, cure cycle and Tg as well as final strength. A TDS mix ratio specified by weight must not be measured by volume.
Compare alternatives in the resin selection guide.
The values above are typical or sales-specification data transcribed from the linked TDS. Use the current TDS/SDS, batch certificate and actual production trial together for design, safety and process decisions.
| Mix ratio by weight | 100:20 |
|---|---|
| Mixed viscosity at 25°C | 1000–1500 (TDS unit) |
| Pot life at 25°C / 100 g | 45 minutes |
| Cure cycle | 8–10 h at 25°C or 2 h at 55°C |
| Working-temperature range | −50–140°C |
| Thermal conductivity | 0.60 W/m·K |
| Water absorption | <0.15% |
| Hardness | Shore D 78–83 |
Electronic-component potting
Power-module packaging
Machine dispensing
Moisture and electrical insulation
Black potting for visual confidentiality
Room-temperature cure
Good flow
Natural defoaming
Electrical insulation
Black opaque appearance
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