EPOXY RESINS
SDF168AB-3 Epoxy Resin
Modified two-component epoxy system for filament winding and RTM.
Product Code: SDF-EPO-027
SDF369AB Epoxy Resin: Solvent-free modified high-temperature epoxy adhesive for hand lay-up and lamination.
Epoxy selection must consider viscosity, pot life, mix ratio, exotherm, cure cycle and Tg as well as final strength. A TDS mix ratio specified by weight must not be measured by volume.
Compare alternatives in the resin selection guide.
The values above are typical or sales-specification data transcribed from the linked TDS. Use the current TDS/SDS, batch certificate and actual production trial together for design, safety and process decisions.
| Mix ratio by weight | 100:20 |
|---|---|
| Part A viscosity at 25°C | 8000–10000 (TDS unit) |
| Part B viscosity at 25°C | 150–200 (TDS unit) |
| Pot life at 25°C / 100 g | 1.5 hours |
| Cure cycle | 2 h at 100°C |
| Tg | 250°C |
| Heat-resistance temperature | 300°C |
| Water absorption | <0.03% |
| Shrinkage | 0.25–0.45% |
Hand lay-up and lamination
Carbon- and glass-fibre composites
High-temperature composite boards
Metal, ceramic, rubber and glass bonding
Electrical insulation parts
Solvent-free formulation
High Tg
Impact and vibration resistance
Low water absorption
Strong adhesion
EPOXY RESINS
Modified two-component epoxy system for filament winding and RTM.
EPOXY RESINS
Modified epoxy system with good flow and defoaming behaviour for vacuum infusion.
EPOXY RESINS
High-temperature-curing epoxy system for filament winding, RTM and vacuum infusion.
EPOXY RESINS
Solvent-free modified high-temperature epoxy adhesive for hand lay-up and lamination.
EPOXY RESINS
Flowable black epoxy system for electronic-component potting and moisture protection.
EPOXY RESINS
Five-minute rapid epoxy adhesive for metal, rigid materials and electronic parts.
EPOXY RESINS
Undiluted bisphenol-A liquid epoxy resin for formulation, coatings, casting and composites…