EPOXY RESINS
SDF168AB-3 Epoxy Resin
Modified two-component epoxy system for filament winding and RTM.
Product Code: SDF-EPO-031
SDF701AB 5 MIN Epoxy Adhesive: Five-minute rapid epoxy adhesive for metal, rigid materials and electronic parts.
Epoxy selection must consider viscosity, pot life, mix ratio, exotherm, cure cycle and Tg as well as final strength. A TDS mix ratio specified by weight must not be measured by volume.
Compare alternatives in the resin selection guide.
The values above are typical or sales-specification data transcribed from the linked TDS. Use the current TDS/SDS, batch certificate and actual production trial together for design, safety and process decisions.
| Mix ratio by weight | 100:100 |
|---|---|
| Part A viscosity at 25°C | 8000–12000 (TDS unit) |
| Part B viscosity at 25°C | 5500–8500 (TDS unit) |
| Pot life at 25°C / 100 g | 2 minutes |
| Heat-deflection temperature | 140°C |
| Thermal conductivity | 0.61 W/m·K |
| Water absorption | <0.15% |
| Hardness | Shore D <85 |
Metal bonding
Rigid-material assembly
Electronic-product bonding
Rapid mould repair
Moisture-resistant potting
Very rapid cure
1:1 ratio by weight
Ambient/low-temperature cure
Strong adhesion
Optional heat-accelerated cure
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